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Can I use lead-free BGAs (SnAgCu solder balls) in a SnPb soldering process?

April 26, 2017BALLS bgas Lead-Free process snagcu SnPb solder soldering

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Can I use lead-free BGAs (SnAgCu solder balls) in a SnPb soldering process?

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A31. Yes, but there is the potential for poor alignment and open joints. Since the usual SnPb reflow profile may not exceed the melting point of the BGAs’ lead-free solder balls, the SnPb solder paste melts but the SnAgCu solder balls do not. The lack of ball collapse may cause a lack of contact between the solder paste and the solder ball. We recommend that you use a reflow profile that ensures the SnAgCu solder balls also melt, and the lead from the molten SnPb solder paste mixes thoroughly. In doing this you should be aware of the affect on any other temperature sensitive components, however. Q32.