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Are Xilinx Pb-free products usable for both Pb-free and Pb-based manufacturing environments?

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Are Xilinx Pb-free products usable for both Pb-free and Pb-based manufacturing environments?

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Xilinx Pb-free solutions that are “backward compatible”, allow customers to surface mount Pb-free components onto Pb-based PCBs and/or use Pb-free products with non-Pb-free technologies. Lead frame packages are qualified as backward compatible. BGA and flip chip packages are not backward compatible and require special processing due to the higher reflow temperature requirements of the BGA Pb-free solutions.

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