Important Notice: Our web hosting provider recently started charging us for additional visits, which was unexpected. In response, we're seeking donations. Depending on the situation, we may explore different monetization options for our Community and Expert Contributors. It's crucial to provide more returns for their expertise and offer more Expert Validated Answers or AI Validated Answers. Learn more about our hosting issue here.

Are Tin/Lead (SnPb) plated peripheral leadframe packages (such as SOIC, PLCC, QFP, etc) forward compatible with the Pb Free board attach process?

April 26, 2017lead leadframe Packages peripheral plated plcc qfp SnPb soic tin

0

Posted

Are Tin/Lead (SnPb) plated peripheral leadframe packages (such as SOIC, PLCC, QFP, etc) forward compatible with the Pb Free board attach process?

1 Answer

0

Posted

It is possible to attach the SnPb package using the Pb Free board attach process if the qualified Package Peak Temperature (PPT) is not exceeded. However, Freescale does not advise using this process.