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Are TI Pb-Free parts compatible with a Pb-based soldering process?

April 26, 2017compatible pb-based Pb-free process soldering TI

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Are TI Pb-Free parts compatible with a Pb-based soldering process?

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TI divides up parts into those that are completely compatible with both Pb and lead-free based solders and soldering temperatures and those that are not compatible. Most TI leadframe based packages utilize Nickel-Palladium-Gold (NiPdAu) finishes and Green mold compounds. This finish & mold compound is fully compatible with current Pb-based solders and reflow temperatures, and newer lead-free solders with their higher reflow temperatures. A limited number of products may initially only be available with a matte-Tin (Sn) finish, which is also compatible with Pb-based soldering processes. Plans to convert to NiPdAu are in development for these products. Most area array products, like TI’s Ball Grid Array (BGA) packages utilize solder balls as the terminal. Conventional Tin-Lead (SnPb) solders are not compatible with lead-free solder balls on BGA’s (typically Tin-Silver-Copper SnAgCu). TI is supplying both SnPb solder ball BGA packages and SnAgCu (lead-free) solder ball BGA packages and wi