Are there special concerns for defense and aerospace applications?
Yes, the possibility of tin whiskers, from the use of pure tin (matte Sn) as a lead (pin) finish, is a major concern for defense and aerospace manufacturers. Most defense or aerospace customers will not use components with a pure tin lead plating finish. Other solutions need to be provided for this market segment. Lead-free array packages (BGA) are made of SnAgCu and will be accepted by defense or aerospace customers.
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