Are there many problems associated with Tin Plating?
There are many problems associated with tin plating. One of which is whiskering, like cadmium and zinc, thin needle-like crystals known as “whiskers” form within a period after plating that may vary from a few weeks to several years. A whisker may measure up to .0001″ (2.5um) in diameter, and grow spontaneously to a length of 0.375″ (10 mm). Conditions that tend to promote the growth of whiskers are compressive stresses and uniform temperatures for long periods of time. In most applications, these slender microscopic crystals would be unnoticed and harmless, but in closely spaced electronic circuits they are capable of carrying sufficient current at low voltages to cause serious short circuits or a corona discharge. When the formation of whiskers is known to be a potential problem, the condition may be prevented by specifying that a small amount of lead be included in the tin deposit. While 1-2% lead is adequate to substantially reduce the risk of whiskering, it is customary to specify
