Are there any considerations I should be aware of if I am planning to order a customized StencilQuik™ stencil?
As a rule, any BGA with a ball pitch of 1.0mm or greater should use the 0.008″ (0.2032mm) thickness and any BGA with a ball pitch of less than 1.0mm should use the 0.004″ (0.1016mm) thickness. The diameter of the apertures should generally be 0.002″ (0.0508mm) larger than the board pad diameter for devices with a ball pitch of 1.0mm or greater. It is desired that after reflow, the solder ball or joint does not contact any part of the StencilQuik™ stencil.
