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Are the lead-free parts backward compatible with SnPb solder process?

April 26, 2017backward compatible Lead-Free process SnPb solder

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Are the lead-free parts backward compatible with SnPb solder process?

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• National’s lead-free leadframe-based surface mount packages are backward compatible. This means that leadframe-based components with matte tin finish can be attached to a PCB using tin/lead solder paste with a tin/lead solder profile (typical peak reflow temperatures ranging from 220° C to 235° C). This is not true for lead-free BGA or microSMD components, which are not compatible with the tin/lead solder process. • National’s lead-free LLP package has been shown to be backward compatible. It is recommended that the peak reflow temperature using tin/lead solder paste be 235 – 240° C, with time > 235° C of 10-30 seconds. • Through-hole packages have not been evaluated for backward compatibility.