Are the lead-free devices the same form, fit, and function?
Most lead-free packages are form, fit and function into a traditional SnPb solder process. There are exceptions.For example a lead-free ball grid array (BGA) package requires a temperature increase to a minimum of 225c, from the 205-220c range used in traditional SnPb solder, in order to achieve proper solderability. Furthermore, this process is not reverse compatible. A traditional SnPb device is not form, fit and function with a lead-free solder process. The reliability of the solder joints is poor and the traditional SnPb component must be qualified to handle 260c, which most are not.
