Are Spansion products low halogen?
Current Spansion Flash memory in leadframe (PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP) packages are “low halogen.” Most FBGA, and MCP packages do not meet the definition of “low halogen” due to the presence of brominated epoxy resins in substrates made using Mitsubishi Gas Chemical CCL-HL 832HS material. Spansion expects to qualify low halogen FBGA and MCP packages for general sales beginning in Q3 2008. These substrates will use Mitsubishi Gas Chemical CCL-HL 832HX type A. Should you find you need low halogen substrate products before that time, please contact Spansion.