What Is Tiny BGA?
With 99% of the computer memory market using TSOP, what exactly is BGA and why does it matter? Ball Grid Array basically describes a different connection method for attaching the memory chips to the PCB or Printed Circuit Board. TSOP (or Thin Small Outline Package) is used in almost every other computer memory on the market. The memory is connected to the PCB by pins on the sides of the memory. BGA does not use pins for attachment. Instead, connections are made with small balls of solder on the PCB. In the ever-increasing move to smaller signal traces in electronics, this allows a shorter connection distance and higher connector density than TSOP. The TSOP and BGA pictures above are at the exact same scale, so another advantage is the really tiny size that can be achieved with BGA memory. This design should also improve heat dissipation. In fact, Kingmax does not even provide heatspreaders with this DDR500 and DDR466 memory. Almost every other memory manufacturer tells us that heatspre
