How do I make electrical contact to the side of the piezoceramic that is bonded down?
The most common method is to make a conductive bond between a metal substrate and the piezo part. Then one electrical lead is attached to the substrate, and one to the outward face of the piezoceramic sheet. In cases where a conductive bond is not possible (i.e. when the substrate is glass or plastic), a wire must be soldered to the “down” side of the ceramic at some location and a corresponding ‘dish’, ‘cutout’, or ‘overhang’ must be used to allow room for the wire when bonding the piezo sheet to the substrate.
