How does Multibeam solve field stitching?
At the start of each run, the MEBIC automatically calibrates each beams size and shape while also calibrating the distance between each beam using interferometry. The high-precision wafer stage combined with high-resolution targets and a stable stage map, allows nanometer placement precision of each e-beam at the substrate. Multibeams proprietary datapath controls each column independently and simultaneously, enabling high placement precision of each pattern with respect to the substrate on the fly, allowing the MEBIC to stitch fields seamlessly and achieve high overlay accuracy.
